Dan Kochpatcharin

Head of Ecosystem and Alliance Management Division,
TSMC

Dan joined TSMC in 2007 and now leads the Ecosystem and Alliance management division, including the EDA, IP, DCA, Cloud, and 3DFabric Alliances under the Open Innovation Platform® (OIP). Previously, he managed the Japan customer strategy, EMEA technical marketing and support team, and was a part of the team leading the formation of OIP, IP Alliance program. Before TSMC, Dan held management roles at Chartered Semiconductor in the US and Singapore and worked at Aspec Technology and LSI Logic.