APAC’S MOST COMPREHENSIVE
Dec 17, 2024 | Click here for Session Timings
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/ Conference theme:
Accelerating Product Design and Innovation for Electronic Systems Value Chain
Dec 17, 2024 | Click here for Session Timings
Already registered? Go to Event
Click register and select your preferred language for sub-titles
/
Conference theme:
Accelerating Product Design and Innovation for Electronic Systems Value Chain.
Dec 17, 2024 | Click here for Session Timings
Already registered? Go to Event
Click register and select your preferred language for sub-titles
/ Conference theme:
Accelerating Product Design and Innovation for Electronic Systems Value Chain
The high-tech, semiconductor, and electronics industries are undergoing a transformative shift as they drive the next-gen technology innovations. This evolution is powered by advances in compute and storage capabilities, breakthroughs in networking and communication, and innovations in semiconductor packaging, manufacturing, and fabrication. The demand for faster, more efficient, and highly integrated systems is pushing the boundaries of technology, driving companies to rethink how they design and manufacture their products.
However, this rapid progress presents significant engineering challenges, as it requires meeting the desired performance, power efficiency, and reliability while ensuring cost and time-to-market goals. Simulation plays a key role in addressing these challenges, enabling rapid prototyping, optimizing designs, and streamlining engineering processes. By leveraging simulation, companies can accelerate the technology innovation and design, reduce time-to-market, and strengthen thier competitive edge in the fast-evolving landscape of next-gen electronics.
Join us for the Ansys SimEDGE, where engineering leaders and experts from global high-tech, semiconductor, and electronics industry will discuss the emerging trends, challenges, solution practices, and role of simulation.
The high-tech, semiconductor, and electronics industries are undergoing a transformative shift as they drive the next-gen technology innovations. This evolution is powered by advances in compute and storage capabilities, breakthroughs in networking and communication, and innovations in semiconductor packaging, manufacturing, and fabrication.
However, this rapid progress presents significant engineering challenges, as it requires meeting the desired performance, power efficiency, and reliability while ensuring cost and time-to-market goals. Simulation plays a key role in addressing these challenges, enabling rapid prototyping, optimizing designs, and streamlining engineering processes. By leveraging simulation, companies can accelerate the technology innovation and design, reduce time-to-market, and strengthen thier competitive edge in the fast-evolving landscape of next-gen electronics.
Join us for the Ansys SimEDGE, where engineering leaders and experts from global high-tech, semiconductor, and electronics industry will discuss the emerging trends, challenges, solution practices, and role of simulation.
The high-tech, semiconductor, and electronics industries are undergoing a transformative shift as they drive the next-gen technology innovations. This evolution is powered by advances in compute and storage capabilities, breakthroughs in networking and communication, and innovations in semiconductor packaging, manufacturing, and fabrication. The demand for faster, more efficient, and highly integrated systems is pushing the boundaries of technology, driving companies to rethink how they design and manufacture their products.
However, this rapid progress presents significant engineering challenges, as it requires meeting the desired performance, power efficiency, and reliability while ensuring cost and time-to-market goals. Simulation plays a key role in addressing these challenges, enabling rapid prototyping, optimizing designs, and streamlining engineering processes. By leveraging simulation, companies can accelerate the technology innovation and design, reduce time-to-market, and strengthen their competitive edge in the fast-evolving landscape of next-gen electronics.
Join us for the Ansys SimEDGE, where engineering leaders and experts from global high-tech, semiconductor, and electronics industry will discuss the emerging trends, challenges, solution practices, and role of simulation.
/ Next-gen technology trends
/
Multi-scale and multiphysics simulation
/
Digital engineering (AI, cloud, GPU, MBSE, digital twin)
/ Chip-package-system
/ Optics and photonics
/
Packaging, assembly and testing
/ Domain focus: Data centre, memory and storage, Networking and communication, Manufacturing, Assembly, Testing
/
Next-gen technology trends
/
Multi-scale and multiphysics simulation
/
Digital engineering (AI, cloud, GPU, MBSE, digital twin)
/ Chip-package-system
/ Optics and photonics
/
Packaging, assembly and testing
/ Domain focus: Data centre, memory and storage, Networking and communication, Manufacturing, Assembly, Testing
/
Next-gen technology trends
/
Multi-scale and multiphysics simulation
/
Digital engineering (AI, cloud, GPU, MBSE, digital twin)
/ Chip-package-system
/ Optics and photonics
/
Packaging, assembly and testing
/
Domain focus: Data centre, memory and storage, Networking and communication, Manufacturing, Assembly, Testing
/ OEMs/Device Manufacturers
/
Chip Manufacturers and Foundries
/
Equipment Manufacturers
/ OSAT companies and IC design houses
/ Engineering service providers
/ Research Institutes
/ OEMs/Device Manufacturers
/
Chip Manufacturers and Foundries
/
Equipment Manufacturers
/ OSAT companies and IC design houses
/
Engineering service providers
/
Research Institutes
/ OEMs/Device Manufacturers
/
Chip Manufacturers and Foundries
/
Equipment Manufacturers
/
OSAT companies and IC design houses
/ Engineering service providers
/ Research Institutes
Conference Tracks
/ Compute & Data Storage
To simulate modern, complex products and systems at scale, organizations need the flexibility and open ecosystem provided by the latest advancements in hyperscale and cloud computing, along with robust data storage solutions. This track will focus on various topics around compute and data storage from component to system level simulation.
/ Networking & Communication
Emerging technologies have been revolutionizing product experience entirely. From V2V/V2X and 5G, to augmented reality, over-the-air upgrade, and remote diagnostics, these technologies have accelerated the move towards smarter and more connected world. This track will focus on various topics including electromagnetics, high speed interfaces, advanced 5G/ 6G, real time radar, V2V communication with covering advances in design and validation practices.
/ Electronics Reliability
Electromagnetic simulation enables the successful modeling, analysis and design of many high- and low-frequency electronics, including computing platforms, generators and transformers, communications systems and satellites, and ADAS systems, to name a few. This track will focus on various aspects of electronic development including topics around manufacturing, packaging, assembly, testing and life estimation.
/ Compute & Data Storage
To simulate modern, complex products and systems at scale, organizations need the flexibility and open ecosystem provided by the latest advancements in hyperscale and cloud computing, along with robust data storage solutions. This track will focus on various topics around compute and data storage from component to system level simulation.
/ Networking & Communication
Emerging technologies have been revolutionizing product experience entirely. From V2V/V2X and 5G, to augmented reality, over-the-air upgrade, and remote diagnostics, these technologies have accelerated the move towards smarter and more connected world. This track will focus on various topics including electromagnetics, high speed interfaces, advanced 5G/ 6G, real time radar, V2V communication with covering advances in design and validation practices.
/ Electronics Reliability
Electromagnetic simulation enables the successful modeling, analysis and design of many high- and low-frequency electronics, including computing platforms, generators and transformers, communications systems and satellites, and ADAS systems, to name a few. This track will focus on various aspects of electronic development including topics around manufacturing, packaging, assembly, testing and life estimation.
Session timings:
Vice President and General Manager – Electronics Semiconductor and Optics Business Unit,
Ansys
Corporate EVP & MD,
Samsung Semiconductor India Research (SSIR
Head of Ecosystem and Alliance Management Division,
TSMC
Regional Vice President, Asia-Pacific
Ansys
Vice President, Product
Ansys
Vice President, Omniverse and Simulation Technology,
NVIDIA
GM of Simulation Dept.
Xiaomi
President, IEEE | President, Coughlin Associates
Regional VP - Customer Excellence APAC,
Ansys
Ansys Fellow,
Ansys
Professional, Convergence Components Development Team,
LG Innotek
Professor,
Pohang University of Science and Technology (POSTECH)
Senior Director
Western Digital
Distinguished Engineer,
Ansys
Senior Director Product Management,
Ansys
Director
Samsung Semiconductor India Research
Reliability Systems Engineer,
ZTE Corporation
Sr. Staff Engineer, Design Technology - PPA R&D,
Qualcomm
Director,
Ansys
Distinguished Engineer,
Ansys
Senior Member of Technical Staff,
AMD
Signal Integrity Engineer,
Achronix Semiconductor Corporation
Mechanics Director,
ZTE Corporation
Product Manager, On-die Electromagnetics,
Ansys
Manager Application Engineering,
Ansys
Senior Mechanical Design Engineer,
ZTE Corporation
Senior Principal Product Specialist,
Ansys
Senior Manager
Ansys
Distinguished Engineer,
Ansys
Senior Manager,
Ansys
Senior Application Engineer,
Ansys
Principal Application Engineer,
Ansys
Principal Application Engineer, Ansys
Senior Application Engineer,
Ansys
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