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ELECTRONICS DESIGN & INNOVATION VIRTUAL CONFERENCE

Simulation-Enabled Design Innovations for Next-Gen Electronics

Dec 17, 2024 | Click here for Session Timings

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/ Conference theme:
Accelerating Product Design and Innovation for Electronic Systems Value Chain

ELECTRONICS DESIGN & INNOVATION VIRTUAL CONFERENCE

Simulation-Enabled Design Innovations for Next-Gen Electronics

Dec 17, 2024 | Click here for Session Timings

Already registered? Go to Event

Click register and select your preferred language for sub-titles

/ Conference theme:
Accelerating Product Design and Innovation for Electronic Systems Value Chain.

ELECTRONICS DESIGN & INNOVATION VIRTUAL CONFERENCE

Simulation-Enabled Design Innovations for Next-Gen Electronics

Dec 17, 2024 | Click here for Session Timings

Already registered? Go to Event

Click register and select your preferred language for sub-titles

/ Conference theme:
Accelerating Product Design and Innovation for Electronic Systems Value Chain

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6 Hours of Power-Packed Insights
3 Technology Tracks
25+ Knowledge Sessions
30+ Eminent Speakers

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However, this rapid progress presents significant engineering challenges, as it requires meeting the desired performance, power efficiency, and reliability while ensuring cost and time-to-market goals. Simulation plays a key role in addressing these challenges, enabling rapid prototyping, optimizing designs, and streamlining engineering processes. By leveraging simulation, companies can accelerate the technology innovation and design, reduce time-to-market, and strengthen thier competitive edge in the fast-evolving landscape of next-gen electronics.

Join us for the Ansys SimEDGE, where engineering leaders and experts from global high-tech, semiconductor, and electronics industry will discuss the emerging trends, challenges, solution practices, and role of simulation.

The high-tech, semiconductor, and electronics industries are undergoing a transformative shift as they drive the next-gen technology innovations. This evolution is powered by advances in compute and storage capabilities, breakthroughs in networking and communication, and innovations in semiconductor packaging, manufacturing, and fabrication.

However, this rapid progress presents significant engineering challenges, as it requires meeting the desired performance, power efficiency, and reliability while ensuring cost and time-to-market goals. Simulation plays a key role in addressing these challenges, enabling rapid prototyping, optimizing designs, and streamlining engineering processes. By leveraging simulation, companies can accelerate the technology innovation and design, reduce time-to-market, and strengthen thier competitive edge in the fast-evolving landscape of next-gen electronics.

The high-tech, semiconductor, and electronics industries are undergoing a transformative shift as they drive the next-gen technology innovations. This evolution is powered by advances in compute and storage capabilities, breakthroughs in networking and communication, and innovations in semiconductor packaging, manufacturing, and fabrication. The demand for faster, more efficient, and highly integrated systems is pushing the boundaries of technology, driving companies to rethink how they design and manufacture their products.

However, this rapid progress presents significant engineering challenges, as it requires meeting the desired performance, power efficiency, and reliability while ensuring cost and time-to-market goals. Simulation plays a key role in addressing these challenges, enabling rapid prototyping, optimizing designs, and streamlining engineering processes. By leveraging simulation, companies can accelerate the technology innovation and design, reduce time-to-market, and strengthen their competitive edge in the fast-evolving landscape of next-gen electronics.

Key Topics Covered:

/ Next-gen technology trends
/ Multi-scale and multiphysics simulation
/ Digital engineering (AI, cloud, GPU, MBSE, digital twin)

/ Chip-package-system

/ Optics and photonics

/ Packaging, assembly and testing

/ Domain focus: Data centre, memory and storage, Networking and communication, Manufacturing, Assembly, Testing

/ Next-gen technology trends
/ Multi-scale and multiphysics simulation
/ Digital engineering (AI, cloud, GPU, MBSE, digital twin)

/ Chip-package-system

/ Optics and photonics

/ Packaging, assembly and testing

/ Domain focus: Data centre, memory and storage, Networking and communication, Manufacturing, Assembly, Testing

/ Next-gen technology trends
/ Multi-scale and multiphysics simulation
/ Digital engineering (AI, cloud, GPU, MBSE, digital twin)

/ Chip-package-system

/ Optics and photonics

/ Packaging, assembly and testing

/ Domain focus: Data centre, memory and storage, Networking and communication, Manufacturing, Assembly, Testing

Who Should Attend?

/ OEMs/Device Manufacturers
/ Chip Manufacturers and Foundries
/ Equipment Manufacturers

/ OSAT companies and IC design houses
/ Engineering service providers
/ Research Institutes

/ OEMs/Device Manufacturers
/ Chip Manufacturers and Foundries
/ Equipment Manufacturers

/ OSAT companies and IC design houses
/ Engineering service providers
/ Research Institutes

/ OEMs/Device Manufacturers
/ Chip Manufacturers and Foundries
/ Equipment Manufacturers

/ OSAT companies and IC design houses
/ Engineering service providers
/ Research Institutes

Conference Tracks

/ Compute & Data Storage

To simulate modern, complex products and systems at scale, organizations need the flexibility and open ecosystem provided by the latest advancements in hyperscale and cloud computing, along with robust data storage solutions. This track will focus on various topics around compute and data storage from component to system level simulation.

/ Networking & Communication

Emerging technologies have been revolutionizing product experience entirely. From V2V/V2X and 5G, to augmented reality, over-the-air upgrade, and remote diagnostics, these technologies have accelerated the move towards smarter and more connected world. This track will focus on various topics including electromagnetics, high speed interfaces, advanced 5G/ 6G, real time radar, V2V communication with covering advances in design and validation practices.

/ Electronics Reliability

Electromagnetic simulation enables the successful modeling, analysis and design of many high- and low-frequency electronics, including computing platforms, generators and transformers, communications systems and satellites, and ADAS systems, to name a few. This track will focus on various aspects of electronic development including topics around manufacturing, packaging, assembly, testing and life estimation.

/ Compute & Data Storage

/ Networking & Communication

/ Electronics Reliability

Agenda

Session timings:

English sessions: 11:00 am – 04:30 pm (India time)
07:30 am – 01:00 pm (Central European time)
01:30 pm - 07:00 pm (Singapore time)
Chinese sessions: 11:00 am – 04:30 pm (China time)
Japanese sessions: 11:00 am – 04:30 pm (Japan time)
Korean sessions: 11:00 am – 04:30 pm (Korea time)
Taiwan sessions: 11:00 am – 04:30 pm (Taiwan time)